Ferro-Ceramic Grinding Inc. machines over 15 different materials
Aluminum Nitride Ceramic materials physical, mechanical, thermal and electrical properties reference chart.
Aluminum Nitride Properties
While AlN is not a ‘new’ material, recent manufacturability developments over the past 15 years have made this an exciting and viable ceramic design material.
One of the most useful applications AlN has found is in replacing beryllium oxide (BeO) in the semiconductor industry. This substitution is due to BeO’s toxicity. The thermal expansion coefficient of AlN is lower than BeO or alumina, and closely matches that of the silicon wafers used in electronics. Once a limitation for AlN’s use in electronic applications there are now processes to metallize AlN.
There are electronic and structural grades of this material, classified as such by the thermal conductivity, which is controlled by the purity of the AlN. Pristine material is White, high purity is tan, and grey color indicates contaminants.
|Density, r||g/cm3||ASTM C20||3.25|
|Water Absorption||% @R.T.||ASTM C373||0|
|Hardness||knoop (kg/mm2)||Knoop 100g||1170|
|Compressive Strength||MPa @ R.T.||ASTM C773||2068|
|Tensile Strength||MPa @ R.T.||ACMA Test #4||--|
|Modulus of Elasticity|
|Flexural Strength (MOR)||MPa @ R.T.||ASTM F417||428|
|Poisson's Ratio, u||-||ASTM C818||0.25|
|Fracture Toughness, KIc||MPa x m1/2||Notched Beam Test||3.5|
|Max. Use Temperature|
(* denotes inert atm.)
|ºC||No load cond.||1600|
|Thermal Shock Resistance||DT (ºC)||Quenching||400|
|Thermal Conductivity||W/m-K @ R.T.||ASTM C408||170|
|Coefficient of Linear Thermal Expansion, al||mm/m-ºC (~25ºC through ±1000ºC)||ASTM C372||4.6-5.7|
|Specific Heat, cp||cal/g-ºC @ R.T.||ASTM C351||0.25|
|Dielectric Constant||1MHz @ R.T.||ASTM D150||8.0-9.1|
|Dielectric Strength||kV/mm||ASTM D116||15|
|Electrical Resistivity||Wcm @ R.T.||ASTM D1829||>1014|